News
Visit PTI At Interpack To See The Latest Non-Destructive Package Inspection Technologies
April 20, 2011
Visit PTI at Interpack in Düsseldorf, Germany, May 12 - 18 in Hall 12, Stand C13-03 to see the latest non-destructive package inspection technologies.
Seal-Sensor™
Checks and Verifies Pouch Seal Integrity
- Fast, non-destructive, non-invasive, no sample preparation
- Seal verification and common defect detection (incomplete seals, partial seals, weak seals)
- Suitable for 100% online testing and offline process control
- Beneficial in R&D, package development and production applications
- Non-subjective, repeatable and reliable results
- Economical, cost effective solution for pouch seal inspection.
E-Scan 625
HVLD Micro Leak Testing of Liquid Filled Packaging
- Applications include pre-filled syringes, ampoules, vials,
- BFS, bottles and pouches
- Measures and verifies container closure system integrity
- Detects pinholes, cracks and defective seals
- Offline laboratory testing and high speed 100% online inspection
- Defect detection down to 1 micron
- High level of repeatability and accuracy.
