Multisorb's Electronics Packaging Expert Presented A Moisture Management Solution At IMAPS 2011

Sam Incorvia's presentation, Moisture Control in Thermal Management and Electronics Packaging, addressed extending the life and reliability of electronic devices and assemblies through the environmental control of moisture. Multisorb's Senior Product Leader, Sam Incorvia, presented during the Thermal/Power Management session at the New England Chapter of International Microelectronics and Packaging Society's (IMAPS) 2011 Symposium & Expo.

Moisture is often the last detail to be considered when it comes to packaging of electronic products and devices – often it is too late. Incorporating moisture management early on in the process and selecting materials carefully are critical to ensuring product reliability and meeting service life expectations.

"As the trend in the electronics industry shifts more towards the use of thermoplastics in place of metals for electronic enclosures/devices, the need for moisture management in the design is an absolute must," explains Incorvia.

Incorvia's presentation discussed moisture control for components and for electronic assemblies. He explained moisture not only penetrates through openings in an electronic product's enclosure, but that water vapor will also permeate packaging or housing materials. The vapor transmission rate can vary greatly depending on the type of polymer that is used. Additionally, the environmental conditions of the manufacturing area must be considered, as moisture may inadvertently be sealed into a device at assembly.

Incorvia further explained how silica gel and molecular sieve desiccants work and how they can be used to manage moisture in the packaging or enclosure. The correct desiccant type and prescription must be calculated taking into consideration the factors that introduce moisture into the packaging or enclosure environment.

A range of actual applications using various desiccant forms were shown. Multisorb has successfully managed moisture within an enclosure by securing a compressed, solid-formed desiccant into the product, such as rearview camera lens assemblies and automotive hybrid brake modules. Multisorb also uses a desiccant loaded polymer to integrate the sorbent properties right into an existing component creating a built-in solution.

Sam Incorvia has been with Multisorb Technologies since 1972. As a Senior Product Leader, he has most recently been instrumental in the development of Multisorb's PolySorb™ technology- a highly advance technology that allows desiccant to be incorporated into thermoplastic components, allowing for moisture protection in products where there is no available interior space to add a traditional sorbent.

About Multisorb Technologies
Multisorb Technologies has been an innovator in sorbent technology for over 50 years. Founded in 1961 by John S. Cullen to protect products against the damaging effects of moisture, today Multisorb is the world leader in the development and production of active packaging components.

About Brizman Packaging Business Development Ltd.
Brizman Packaging Business Development Ltd specializes in innovative, professional packaging solutions for professionals in the industry.

Source: Multisorb Technologies