CSP Technologies/ Capital Vial Inc.

CSP Technologies is commercializing new patented materials derived from an entirely new class of polymers. CSP engineers the polymers to control small molecule transport through the materials. The underlying proprietary enabling technology allows for the creation of a microscopic co-continuous interconnecting channel morphology throughout a solid polymer structure. These channels provide pathways that facilitate migration of substances through the polymer, thus enabling a host of exciting new applications, including:

• Polymers which preferentially absorb, scavenge or emit desired small molecules (e.g. Moisture, CO2, O2)
  
• Materials which facilitate or retard the transport of one or more substances
  
• Polymers with novel electronic or ionic transport properties