Find The Latest Innovation At PACK EXPO International 2008

Global brand owners can discover the latest packaging technologies to enhance brand preference, reduce total systems costs, increase supply chain efficiencies and improve sustainability scores by attending PACK EXPO International, November 9–13, 2008 at McCormick Place in Chicago, IL.

With more than 90 percent of exhibit space already sold, PACK EXPO International will highlight innovation across all aspects of packaging, including equipment, components, materials and containers. When the show opens in November, attendees can expect to have access to more than 2,000 exhibitors occupying over 1.1 million net square feet of space.

"With its size and scope comes breadth and depth. PACK EXPO International is a unique opportunity for buying teams to achieve national and global packaging objectives for 2008 and beyond," says Charles D. Yuska, president and CEO of PMMI, the sponsor and producer of PACK EXPO. "Companies can cost-effectively discover a wide range of machinery and materials to refresh existing brands, introduce new products, streamline operations and reduce carbon footprints all in a single location."

Take an In-Depth Look at Technology

Complementing the PACK EXPO International exhibits will be several important technology pavilions. Attendees should look for:

• The Containers & Materials Pavilion, one of the show's most highly visited destinations, will feature advanced materials and containers to enhance brand differentiation, increase sales at the retail shelf and bring greater convenience for stronger brand equity. Nearly 60,000 square feet of space will be dedicated to the latest material and container innovations, about 10 percent more than the previous PACK EXPO International.
• The Showcase of Packaging Innovations, sponsored by The Dow Chemical Company – This gallery will highlight hundreds of award-winning packaging designs from internationally recognized packaging associations. In addition, packages nominated for the PACK EXPO Selects program, which recognizes best-in-class consumer packaging, will also reside here.
• The Radio Frequency Identification (RFID) Pavilion will return to PACK EXPO, highlighting solutions that meet the requirements of the entire supply chain. Included in the exhibits will be technologies to upgrade conventional lines into RFID-enabled packaging lines capable of applying multi-pack, case and pallet tags online. Attendees can also view the latest advances designed to verify the presence of tags, write to the tags and validate data on the tags.
• The Brand Protection Center will focus on the latest security technologies, brand protection devices, tamper evident features and new materials. Government organizations and other informational resources will also be on hand to help guide attendees in the best ways to maintain brand integrity.
• Designed to recognize the importance of contract packaging services in today's vibrant marketplace, the Contract Packaging Pavilion offers a great starting point for assessing a project and exploring the many possible options provided by contract packaging partners. Exhibits will focus on the latest services, packaging formats and machinery available.

Convenient Co-Locations Add More Value

The return of PROCESS EXPO and Converting and Package Printing EXPO (CPP EXPO) as co-located events adds extra convenience and value to the PACK EXPO International experience.

Sponsored and produced by the Food Processing Suppliers Association (FPSA), PROCESS EXPO will highlight the newest developments in processing technology to meet the challenges faced by food, beverage and pharmaceutical manufacturers. Located in the new West Building of McCormick Place, PROCESS EXPO will cover every aspect of the supply chain from equipment and ingredients to services and shipping.

CPP EXPO will focus on the market synergies of the package printing, converting, finishing machinery and supplies industries. Attendees will find the latest technologies for package printing, coating, slitting and other state-of-the-art finishing processes to streamline operations and improve quality. CPP EXPO exhibits will be located on the Lobby Level of Lakeside Center at McCormick Place.

A single admission fee will cover entrance to all PACK EXPO International exhibits and pavilions as well as both co-located events.

For more information about PACK EXPO International 2008, visit www.packexpo.com or contact PMMI's Show Department: (703) 243-8555 or expo@pmmi.org.

About PMMI
PMMI is a trade association with more than 540 member companies that manufacture packaging and packaging-related converting machinery, commercially-available packaging machinery components, containers and materials in the United States and Canada. PMMI's vision is to be the leading global resource for packaging, and its mission is to improve and promote members' abilities to meet the needs of their customers. PMMI organizes the PACK EXPO trade shows: PACK EXPO International, PACK EXPO Las Vegas and EXPO PACK México. Learn more about PMMI at pmmi.org

PACK EXPO International will be held November 9-13, 2008 at McCormick Place in Chicago, Illinois. The show will be co-located with PROCESS EXPO and Converting & Package Printing EXPO. PMMI also produces EXPO PACK México, the premier packaging show in Mexico serving the Latin American region. This show will be held June 24-27, 2008 at Centro Banamex, Mexico City, Mexico. PACK EXPO Las Vegas will be held October 5-7, 2009 at the Las Vegas Convention Center in Las Vegas, Nevada. For more information Visit, www.packexpo.com.

SOURCE: PMMI