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Technology Overview: How To Leak Test Blister Packaging

Source: PTI Packaging and Inspection Systems

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Application Note: Technology Overview: How To Leak Test Blister Packaging
Product Sheet: VeriPac Blister Leak Detection

Most current test methods for blister packages are destructive, time consuming, not sensitive, unreliable, and dependent on the properties of the package lidding material. Small semi-rigid, flexible, and multi-cavity blister packages do not have enough air inside the package to reliably detect defects by simple vacuum decay methods. Water submersion testing can also be used to test small packages, but it is destructive to both product and package, is highly subjective, unreliable and does not detect small defects. Also, it’s impossible to use water submersion to inspect 100% of production. Neither of these inspection methods (vacuum decay or water submersion) will indicate which blister cavity is defective, and the reliability of the test results cannot be guaranteed. Noncontact sensor applications are capable of detecting the location of the defective blister cavity, but are also unreliable and may produce false measurements. Non-contact sensor methods also can be destructive, and laser deflection is very sensitive to the print and reflectivity of the package material.

Click Here To Download:
Application Note: Technology Overview: How To Leak Test Blister Packaging
Product Sheet: VeriPac Blister Leak Detection

PTI Packaging and Inspection Systems